1200 type nano thermal insulation felt
The 1200 type nano thermal insulation board is a new material manufactured using high-tech technology. It is a special inorganic refractory powder that forms small submicron sized pores. At high temperatures, its thermal insulation performance is 2-3 times better than traditional fiber insulation materials. Insulation materials are a good choice for high-temperature equipment with limited space and weight. It has been widely used in various complex thermal equipment abroad, solving many complex insulation problems. The product is in the form of a plate, and can provide external protective layer materials with PE plastic film, aluminum foil, fiber cloth, and other forms.
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1200 type nano thermal insulation felt
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1200 type nano thermal insulation felt
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1200 nano heat insulation board is a new material manufactured by applying high-tech technology, special inorganic refractory powder, forming tiny submicron pores, at high temperature, thermal insulation performance is 2~3 times better than traditional fiber insulation materials. In high-temperature equipment where space and weight are limited, thermal insulation is a better choice. Foreign countries have been widely used in a variety of complex thermal equipment, solved many complex thermal insulation problems, the product form is plate, can provide PE plastic film, aluminum foil, fiber cloth and other forms of outer protective layer materials.
Product use
•Industrial kiln
•Furnace lining insulation
•Heat treatment furnace
•High temperature equipment
•Fireproof equipment
Specifications
250×200 × thickness
Thickness
25~100mm
The reinforced fiber in the safe nano thermal insulation material meets the national standard, will not be inhaled into the human body and cause harm, and is a new type of thermal insulation material that is non-toxic to the
human body.
Product performance
|
color |
white |
|
melting point |
＞1300℃ |
|
Use temperature |
1200℃ |
|
density |
750±10% Kg/m3 |
|
Specific heat 800°C |
0.9 KJ/kgK |
|
compressive strength |
1.0 MPa |
|
Line shrinkage 1100°C |
2.0 % |
|
chemical composition SiO2 ZrO2 other |
90 % 8 % 2 % |
|
Thermal conductivity 400℃ 600℃ 800℃ |
W/ mK 0.060 0.065 0.070 |
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