1050 type nano thermal insulation board
The 1050 nano thermal insulation board is a new material manufactured using high-tech technology, with a special inorganic refractory powder that forms tiny super pores, and its thermal conductivity is even smaller than that of static air. At high temperatures, the insulation performance is 3-4 times better than traditional fiber insulation materials, making it a better insulation material.
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1050 type nano thermal insulation board
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1050 type nano thermal insulation board
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1050 nano heat insulation board is a new material manufactured by applying high-tech technology, special inorganic refractory powder, forming tiny super pores, its thermal conductivity is smaller than that of still air. At high temperature, the thermal insulation performance is 3~4 times better than that of traditional fiber insulation materials, and it is a thermal insulation material with better thermal insulation performance.
1050 type heat insulation board is made of high temperature resistant raw materials, the product use temperature is high, the product has a certain softness, suitable for some high temperature and bending occasions. The product form is plate-like, and the outer protective layer material with PE plastic film, aluminum foil, fiber cloth, etc. can be provided.
Product use
, industrial kiln, furnace lining, heat treatment furnace, high temperature equipment, fire protection equipment
Specifications
·1000×650× thickness· 650×500 × thickness
Thickness
10, 15, 20, 25, 30, 35, 40, 45, 50mm
Safe
nano thermal insulation material in line with the EU European Community 91/155/EEC standards, the reinforcing fiber in line with the WHO standards, will not be inhaled into the human body and cause harm, is a new type of heat insulation material that is not toxic to the human body.
Product performance
|
color |
white |
|
melting point |
＞1200℃ |
|
Maximum operating temperature |
1050℃ |
|
density |
400±10%Kg/m3 |
|
Specific heat 400°C |
1.05 KJ/kgK |
|
Compressive strength (10% compression) |
0.35MPa |
|
Line shrinkage 950°C |
≤2.0 % |
|
chemical composition SiO2 ZrO2 other |
80 % 15 % 5 % |
|
Thermal conductivity 400℃ 600℃ 800℃ |
W/ mK 0.024 0.029 0.034 |
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